Combining the very latest high technology ceramic alloy materials with leading edge computer aided design, this combination has negated any requirement for continuous steel connection though the connection. The new ThermCon^x ® Type A11-F66 from Archtechnik not only solves the problem of thermal bridges at source but also retains the connections ability to take load in compression, tension, and shear, and also cantilever moments, and twisting torsion.

The thermal effectiveness of the high technology materials used in the ThermCon^x connections give them a thermal efficiency of conduction of 0.035 W(Km) compared with a normal conduction efficiency of steel of 47.5 W(Km) and with no loss in their ability to transmit load.

Due to the efficiency of the Thermal break innovation - ThermCon^x - to halt heat energy transferring both ways, the problems of cold spots forming in the walls and ceiling of the building, immediately around where the members protrude through the insulated envelope, are not created. This eliminates the age old problem of mould and mildew forming on the internal surfaces of the building in these areas as the colder outside temperatures are conducted via the cold bridge back into the building creating sections of internal surface areas known as cold spots, when these areas come into contact with the warmer moist air of the inside of the building the warmer, moist air gives up its water in the form of condensation on the surface of the cold spot, this in turn forms mould etc etc.

With ThermCon^x it is quite simple.

• No cold bridge

• No cold spots

• No condensation

• No mould

• (No litigation)
  
  

Download the ThermCon^x brochure

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